Samsung to Use TSMC Process for Nvidia Custom HBM Base Dies, Report Says
· TexaHub · Semiconductors, Artificial Intelligence
Samsung Electronics plans to use TSMC's 3-nanometre process for base dies in Nvidia's next-generation custom high-bandwidth memory, a Seoul newspaper reported. It would be Samsung's first collaboration with TSMC at the HBM manufacturing stage.
Memory supply chain
Reuters, citing the Seoul Economic Daily, reported on October 18 that Samsung will make base dies for Nvidia's NVHBM on TSMC's 3-nanometre process. Nvidia has asked Samsung, SK Hynix and Micron to use the TSMC process for base dies and sixth-generation DRAM for core dies, the newspaper said. [1]
Nvidia unveiled NVHBM in August. The design integrates Nvidia's custom memory controller into the base die. Samsung would keep in-house production for standard HBM, and is reportedly assessing its own foundry as a backup if TSMC capacity runs short. [1]
Sources
[1] Samsung to use TSMC technology for Nvidia's next-generation memory chips, Seoul newspaper reports — The Star (Reuters)