GlobalFoundries to Make Silicon Interposers for TSMC in New York Under $2 Billion Deal
· TexaHub · Semiconductors, Geopolitics & Tech
GlobalFoundries and TSMC agreed a multi-year, $2 billion deal for silicon interposers used in CoWoS packaging. Volume production at Malta, New York is expected in the first half of 2028.
Deal Terms
GlobalFoundries announced on 8 October a manufacturing agreement with TSMC to produce silicon interposers for TSMC's CoWoS advanced-packaging ecosystem at its Malta, New York site. The company said it would be the first US-based source of such components [1].
The deal is valued at $2 billion with an initial five-year term; volume production is expected to ramp in the first half of 2028 [1][2]. Verdict reported that GF plans to expand capacity at the New York site [2].
Why It Matters
Advanced packaging is a recognised bottleneck for AI accelerators. GF's Ed Kaste said it is "becoming increasingly critical to delivering the performance, power efficiency and scale required for next-generation AI systems" [1].
Semiconductor Engineering listed the agreement in its 9 October weekly review [3].
Sources
[1] GlobalFoundries reaches agreement to establish U.S.-based supply of silicon interposers for advanced AI packaging — GlobalFoundries, 8 Oct 2026
[2] GlobalFoundries and TSMC agree on $2bn US silicon interposer supply deal — Verdict, 9 Oct 2026
[3] Chip Industry Week In Review — Semiconductor Engineering, 9 Oct 2026